Radioelektronikos terminų žodynas. – Vilnius : BĮ UAB „Litimo“. Kazimieras Gaivenis, Gytis Juška, Vidas Kalesinskas. 2000.
chip-on-board process — lustų montavimas ant plokštės statusas T sritis radioelektronika atitikmenys: angl. chip on board mounting; chip on board process vok. Chipplazierung unmittelbar auf der Platine, f rus. монтаж кристаллов ИС на плате, m pranc. montage des puces… … Radioelektronikos terminų žodynas
Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads … Wikipedia
Printed circuit board — Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through hole paths to the other surface), and some mounted electrical components A printed circuit board, or PCB, is used to… … Wikipedia
Chipplazierung unmittelbar auf der Platine — lustų montavimas ant plokštės statusas T sritis radioelektronika atitikmenys: angl. chip on board mounting; chip on board process vok. Chipplazierung unmittelbar auf der Platine, f rus. монтаж кристаллов ИС на плате, m pranc. montage des puces… … Radioelektronikos terminų žodynas
lustų montavimas ant plokštės — statusas T sritis radioelektronika atitikmenys: angl. chip on board mounting; chip on board process vok. Chipplazierung unmittelbar auf der Platine, f rus. монтаж кристаллов ИС на плате, m pranc. montage des puces sur la carte, m … Radioelektronikos terminų žodynas
montage des puces sur la carte — lustų montavimas ant plokštės statusas T sritis radioelektronika atitikmenys: angl. chip on board mounting; chip on board process vok. Chipplazierung unmittelbar auf der Platine, f rus. монтаж кристаллов ИС на плате, m pranc. montage des puces… … Radioelektronikos terminų žodynas
монтаж кристаллов ИС на плате — lustų montavimas ant plokštės statusas T sritis radioelektronika atitikmenys: angl. chip on board mounting; chip on board process vok. Chipplazierung unmittelbar auf der Platine, f rus. монтаж кристаллов ИС на плате, m pranc. montage des puces… … Radioelektronikos terminų žodynas
Surface-mount technology — (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount… … Wikipedia
Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads … Wikipedia
Integrated circuit packaging — Early USSR made integrated circuit Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.Packaging in ceramic or plastic prevents physical damage and corrosion and supports the… … Wikipedia
